CES 2026 showcases the latest AI-powered devices and systems, from vision chips for automotive to sensing solutions for AI ...

AALTER, BELGIUM / SAN JOSE, CALIFORNIA – Sofics® bv, a global leader in on-chip electrostatic discharge (ESD) and specialty I ...

Cadence is also collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence Physical AI ...

I’m usually racing along at full pace with little time to think. When I do pause to reflect on life, the universe, and everything, I find it hard to believe how much has changed since I first picked ...

At CES 2026, Cadence announced an ecosystem which delivers pre-validated (spec-to-packaged parts) for physical AI, data centre and HPC (high performance computing).

Cadence's new Chiplet Spec-to-Packaged Parts partner ecosystem reduces engineering complexity and accelerates time to market for chiplet development.

Intel is revealing concrete specifications for the Panther Lake processors. However, power consumption is increasing in some areas.

Intel's prior-generation Lunar Lake chips were largely made by TSMC. The stakes for Intel are high - the company is making its first high-volume product with 18A, and hopes to reclaim the market share ...

To simplify complex vehicle software management, TI is partnering with Synopsys to provide a Virtualizer (TM) development kit for TDA5 SoCs. The kit's digital twin capabilities help engineers ...

Dr. Witt is the author of “The Radical Fund: How a Band of Visionaries and a Million Dollars Upended America.” In a year when the United States seemed more split than ever, Americans united in one way ...

Avnet ASIC, together with Bar-Ilan University, announced a strategic collaboration to establish an Advanced Chiplet Innovation Center, scheduled to open in 2026. Located within Avnet ASIC’s facility, ...