insights from industryStephan Botzki & Ian McEnteggartSenior Applications Engineer - Composites Market ManagerInstron In this interview, industry experts Stephan Botzki and Ian McEnteggart, senior ...
Carefully controlled post-sintering deformation proves key to boosting strength while preserving ductility in Cu-SiC materials used for thermal and electrical ...
Hollow Glass Microspheres are inorganic, nonmetallic spherical materials created by specific processes, commonly with diameters in the range of 10 to 250 μm and wall thicknesses of 1 to 2 μm (Figure 1 ...
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