Monterey, Calif. – A host of new challenges is quickly descending on IC physical design, according to presenters at the International Symposium on Physical Design 2003 here earlier this month.

As designers move to 65nm technologies and below, the convergence of performance-driven design constraints and yield-driven manufacturing constraints intensifies the demand for new approaches for ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

Takumi Inspect and Takumi Enhance from Takumi Technology Corp. not only find but also correct problems that can reduce yields and slow down manufacturing ramp up. Increasing price competition and ...

SAN DIEGO, Feb. 02, 2021 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT” or the “Company”), started a research project, internal name VeriSpeed, to develop new system and methods to ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--ATopTech, the leader in next generation physical design solutions, today announced that Aprisa™ and Apogee TM, the company’s place and route solution, are ...

The urgency for change: Are traditional DRC debug flows enough? Physical verification engineers know all too well the reality of debugging massive integrated circuit (IC) designs. For years, the ...

The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...

In 2022, the overall revenue of the global IC design industry reached US$215.4 billion. Among them, the US IC design sector is the largest in scale, with a 63% market share and revenue of over US$130 ...