Amkor Technology Inc. today announced that it is building a wafer bumping plant in Singapore using the same processes currently employed by Amkor's Unitive subsidiary in Taiwan. Amkor expects to ...

MINNEAPOLIS--(BUSINESS WIRE)-- CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the SEMICON ...

Custom DC positioners with theta-X planarizing capability and true Kelvin probes have allowed for successful demonstration of consistent and repeatable test results in fully automatic micro-bump wafer ...

To support increased customer demand, Kulim, Malaysia-based semiconductor wafer foundry Silterra Malaysia Sdn. Bhd. reported today it has increased production capacity of its manufacturing fab by 20 ...

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...

At the recent IEEE Electronic Components and Technology Conference (ECTC), Imec presented a paper on a fine-pitch hybrid wafer-to-wafer bonding technology for heterogeneous integration. Imec described ...