The benefits of thermal interface materials. Comparing FR-4 laminate with insulated metal substrate (IMS) PCB. How phase-change TIMs may prove to be the best solution. One of the most important—and ...
The collaboration announced at The Battery Show North America combines Dow's silicone legacy with Carbice's CNT technology to provide innovative thermal management products. This partnership will ...
Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...
Dow and Carbice, a pioneer in carbon nanotube (CNT) technology, have announced a strategic, first-of-its-kind partnership to provide a multi-generational thermal interface material (TIM) product ...
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