“Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...

SHENZHEN, China--(BUSINESS WIRE)--BISTel, the world leader in engineering automation systems (EES) and AI applications for semiconductor and flat panel display smart manufacturing announced today that ...

Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...