Business Wire

Applied Materials Extends Copper/Low k Leadership with Innovative CMP Technology; Reflexion LK CMP System Planarizes Delicate Low k Interconnects at High Production Speeds

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...
EDN

Applied announces low down-force, low-k CMP machine

SANTA CLARA, Calif. — Applied Materials Inc. has announced the Reflexion LK chemical mechanical polishing (CMP) system, a machine that has a “low down-force” and is intended to planarize a range of ...
Business Wire

Applied Materials Revolutionizes Planarization Technology with Breakthrough Reflexion LK Ecmp System

SANTA CLARA, Calif.--(BUSINESS WIRE)--July 12, 2004--Applied Materials, Inc. (Nasdaq:AMAT) today announces a major breakthrough in planarization technology with its revolutionary 300mm Applied ...
EDN

Applied Releases Low Down Force CMP Tool

Applied Materials Inc. today announced Reflexion LK, what it said is the industry's only low down force chemical mechanical polishing (CMP) system that planarizes low k and ultra-low k dielectric ...
C&EN

CMP Road Gets Rough

At the semicon west semiconductor equipment and materials trade show in San Francisco last month, competing announcements spelled potential trouble for companies in the fast-growing business of ...