Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

It is no mystery that the semiconductor industry is always advancing, with specifications becoming increasingly stringent as defects become increasingly more difficult to discover. This is especially ...