Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

While Tesla aims to reduce the amount of silicon carbide (SiC) components by 75%, sources in the related industrial sectors nevertheless believe that SiC, with its good heat resistance capability, ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

DUBLIN, June 12, 2020 /PRNewswire/ -- The "Technology Landscape, Trends and Opportunities in the Global Semiconductor and IC Packaging Material Market" report has been added to ...

Federal officials have announced Arizona State University would land a major laboratory to further research the packaging of semiconductors. Many details have yet to be disclosed, and the deal has not ...

System vendors are seeking capacity support from IC analysis laboratories for 2024 through their contracted IP service providers, as they foresee high demand for advanced packaging, according to ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

DUBLIN--(BUSINESS WIRE)--The "United States 3D IC and 2.5D IC Packaging Market: Prospects, Trends Analysis, Market Size and Forecasts up to 2024" report has been added to ResearchAndMarkets.com's ...

NEW YORK, Sept. 16, 2021 /PRNewswire/ -- Zion Market Research has published a new report titled "Semiconductor and IC Packaging Material Market By Type (Lead Frames, Bonding Wires, Ceramic Packages, ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...