A semiconductor manufacturing company has little control over the system in which its parts are used. However, the system in which the IC is mounted is critical to overall device performance. For ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...

Last month’s column talked about a simpler way to exchange stackups with manufacturing partners. This month, continuing the ...

Eventually, almost every EE must design a PCB, which isn’t something that’s taught in school. Yet engineers, technicians, and even novice PCB designers can create high-quality PCBs for any and every ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

When analyzing the supply and demand of global semiconductor design talents in 2021, one finds US-based companies to be the main source of chip design demand. US-based companies accounted for 43% of ...