Could you give us a brief history of Neu Dynamics? Kevin Hartsoe, President, Neu Dynamics/NDC International: Neu Dynamics was founded in 1972 as an engraving and stamping die shop that eventually ...

The global Fully Automatic Semiconductor Molding System market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, growing at a CAGR of % during the forecast period. The ...

Initially, NIL was used for flash-curing polymer precursors and embossing thermoplastic resists. However, as the demand for high-density material architectures in the semiconductor industry grew, new ...

Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

Nordson MARCH's automated plasma tool innovations address the need to provide contamination-free surfaces for small and highly sensitive packaging devices. They activate surfaces for better adhesion ...