The Korea Research Institute of Standards and Science has successfully developed a high-quality compound semiconductor ...

DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...

ORLANDO, Fla.--(BUSINESS WIRE)--Laser Photonics Corporation (LPC) (NASDAQ: LASE), a leading global industrial developer of systems for laser cutting, marking and other material applications, announced ...

In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications. Please could you introduce yourself and ...

Dublin, Nov. 12, 2025 (GLOBE NEWSWIRE) -- The "The Global Market for Polymeric Materials for Advanced Electronic Packaging 2026-2036" report has been added to ResearchAndMarkets.com's offering. The ...

Key semiconductor material distributor Chang Wah Electromaterials (CWE) has announced new pricing for epoxy molding compounds effective from the third quarter of 2024, due to a weak Japanese Yen. Save ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...