In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...
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