VISTA, Calif. – Palomar Technologies, a manufacturer of automated assembly systems, has paired up two machines, the Gold Bumper and its flip-chip thermocompression bonder to create a gold bump attach ...

This ball-bonder type wire-bonding machine makes delicate welds at breakneck speeds. It requires many of the same stage and controller capabilities as automated IC programmers, PCB assemblers, FPD and ...

As much of the industry moves toward lead-free processes, gold wire is emerging as an alternative. For example, Palomar Technologies' Model 8000 gold ball-and-stitch thermosonic wire bonder is now ...

Gold bonding wire is considered the single most important application of gold in terms of tonnage of gold utilized per annum. Wire bonding is a technique used to join very fine gold wire (usually ...

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The ...

Potential new areas of application for gold include the use of gold compounds in organic light emitting diodes and optoelectronic devices. Gold-plated contacts and connectors are probably the most ...