TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.

TL;DR: SKC is advancing glass substrate technology for high-performance semiconductors, collaborating with AMD and Amazon AWS on final quality tests. The company plans to increase production capacity ...

TOKYO and SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to ...

That’s a question many on the heterogeneous integration (HI) side of the semiconductor industry are asking. Unfortunately, the answer is not straightforward. But before we get to answering that, let’s ...