TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates. The new line will come online in January and is designed to support high ...
The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...
In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is ...
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