Business Wire

Research and Markets: AT&S ECP Embedded Power Die Package - GaN Systems GaNpx Top Cooled - Reverse Costing Analysis

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/8hkb2l/atands_ecp) has announced the addition of the "AT&S ECP® Embedded ...
Business Insider

Global Embedded Die Packaging Technology Market - Expected to Rise at a CAGR of 14.8 % During 2017-2023

The "Global Embedded Die Packaging Technology Market Research Report Insights, Opportunity Analysis, Market Shares and Forecast, 2017 - 2023" report has been added to Research and Markets' offering.
EDN

Reverse cost analysis of dc/dc converter module with embedded die packaging

Rohm and TDK-EPC have joined forces to provide an alternative solution for embedded die technology. This SiP module is a second-source supply of the Texas Instruments MicroSiP DC/DC Converter.
Semiconductor Engineering

SiPs: The Best Things in Small Packages

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...
Digi Times

ASE promotes embedded die packaging for automotive electronics

Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive electronic ...
EDN

Reportlinker Adds Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in Substrate

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...