Blue Cheetah Analog Design has successfully taped-out its next generation BlueLynx die-to-die (D2D) PHY on Samsung Foundry's SF4X 4nm advanced manufacturing process. Credit: Vendula - adobe.stock.com ...
At CES 2026, Cadence announced an ecosystem which delivers pre-validated (spec-to-packaged parts) for physical AI, data ...
“Trilinear Technologies is excited to provide our advanced DisplayPort IP as part of this innovative initiative. Collaborating with Cadence enables us to drive high-performance video connectivity and ...
Chiplet PHY simulator addresses the effects of forward clocking with single-ended signaling and higher bit error rate on die-to-die interconnect performance of ...
July 7, 2022 -- In March 2022, chipmakers Intel, TSMC, and Samsung joined forces with ten industry giants including ASE Group, AMD, ARM, Qualcomm, Google, Microsoft, and Meta (Facebook) to launch UCle ...
The open chiplet ecosystem is steadily taking shape, one design demonstration at a time. Take, for instance, Alphawave Semi, which has announced the tape-out of what it claims to be the industry’s ...
Eliyan, the chiplet interconnect specialist, has got first silicon of its NuLink-2.0 PHY, manufactured on a 3nm process. The device achieves 64Gbps/bump, claimed to be the industry’s highest ...
What’s Arm up to in design and development of chiplets, the highly integrated large-scale silicon solutions? The IP giant is gradually unveiling its design blueprint for one of the most exciting ...
Semiconductor startup Eliyan Corp. today announced that it has reached first silicon, meaning its chip technology was successfully manufactured at a fabrication facility. Eliyan used Taiwan ...
The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are ...
Collaboration gives QuickLogic early access to Intel Foundry's advanced process and packaging roadmaps and strengthens its strategy to deliver secure, interoperable eFPGA-based chiplets for defense ...
The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback