First order process modeling can help tremendously with process setup and integration challenges that occur in a semiconductor fabrication flow, by visualizing process variation problems “virtually” ...

Machine learning (ML), neural networks (NNs), and deep learning have many applications in different areas of modern industry and life. Their ability to “learn” how to analyze and predict imprecise ...

The problem of variations induced by the chemical-mechanical polishing (CMP) step has been discussed for years in process engineering circles. Briefly, after each layer on the wafer is completed, the ...

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...