This application note provides the PCB design and SMT assembly guidelines for Maxim Integrated’s leaded packages (SOIC, TSSOP, QSOP, QFP, SC70, SOP, SOT, etc.). Leaded packages are surface-mount ...
This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...
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