Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

New chip to be faster and more power-efficient. May 5, 2011— -- In today's TechBytes: a significant development in computer chip design. Intel has unveiled a three-dimensional chip with a ...

Forward-looking: Researchers at the University of Massachusetts Amherst have developed a laser-based technique to align 3D semiconductor chips, potentially overcoming a longstanding challenge in chip ...

HRL will present initial data from the project at the GOMACtech conference next week in Pasadena, Calif. HRL is directing the overall program, leading the system design, developing thermal isolation ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...